Intel Celeron G4400 3.3 GHz Dual-Core Dual-Thread 54W CPU Processor LGA 1150 Компьютеры и офис - купить

General information

Type

CPU / Microprocessor

Market segment

Desktop

Family

Model number  ? 

CPU part numbers

CM8066201927306 is an OEM/tray microprocessor

BX80662G4400 is a boxed processor with fan and heatsink (English version)

BXC80662G4400 is a boxed processor with fan and heatsink (Chinese version)

Frequency ? 

3300 MHz

Bus speed ? 

8 GT/s DMI

Clock multiplier ? 

33

Package

1151-land Flip-Chip Land Grid Array

Socket

Socket 1151 / H4 / LGA1151

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

September 1, 2015 (announcement)
September 1, 2015 (availability in Asia)
September 27, 2015 (availability elsewhere)

End-of-Life date

Last order date for consumer processors is August 24, 2018
Last shipment date for consumer processors is August 24, 2018

Price at introduction

$64

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Skylake

Processor core  ? 

Skylake-S

Core steppings  ? 

R0 (SR2DC)
S0 (QJZK)

Manufacturing process

0.014 micron

Data width

64 bit

The number of CPU cores

2

The number of threads

2

Floating Point Unit

Integrated

Level 1 cache size  ? 

2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

2 x 256 KB 4-way set associative caches

Level 3 cache size

3 MB 12-way set associative shared cache

Physical memory

64 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

MMX instructions

SSE / Streaming SIMD Extensions

SSE2 / Streaming SIMD Extensions 2

SSE3 / Streaming SIMD Extensions 3

SSSE3 / Supplemental Streaming SIMD Extensions 3

SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

AES / Advanced Encryption Standard instructions

EM64T / Extended Memory 64 technology / Intel 64  ? 

NX / XD / Execute disable bit  ? 

VT-x / Virtualization technology  ? 

VT-d / Virtualization for directed I/O

SGX / Software Guard Extensions

SMAP / Supervisor Mode Access Prevention

Low power features

Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Display controller

3 displays

Integrated graphics

GPU Type: HD 510
Graphics tier: GT1
Microarchitecture: Gen 9
Execution units: 12
Base frequency (MHz): 350
Maximum frequency (MHz): 1050

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
ECC supported: Yes

Other peripherals

Direct Media Interface 3.0

PCI Express 3.0 interface (16 lanes)

Electrical / Thermal parameters

Maximum operating temperature  ? 

100°C

Thermal Design Power ? 

54 Watt