LY G720 Semi automatic align BGA soldering Station With Reball Kit for Laptops Game consoles 220V Инструменты - купить
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Купить LY G720 Semi automatic align BGA soldering Station With Reball Kit for Laptops Game consoles 220V | Инструменты






LY G720 Semi-automatic align BGA Rework Station With Reball Kit for Laptops/Game consoles 220V 110V
Video:
1.Basic Operations:
https://youtu.be/rX_J061xtVc
2.Work with mobile motherboard chipsets
https://youtu.be/71-DBp-cfmM
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LY G700 & G720 comparison |
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Same |
Power |
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Machine size |
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Pre-heating size |
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Cartoon size |
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Gross Weight |
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Differences |
G700 color: Obsidian Black |
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G720 equipped more better camera & lens than G700,so align system is more clearer than G700. |
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G700 only have Manual,Semi-auto.2 working modes. |
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The Features of LY-G720 bga rework station :
1.HD Optical alignment system for precisely mounting BGA and components
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm, Repair success rate 99.9%
4.Laser Positioning function for fast positioning the BGA Chip and motherboard
5.Precise Temperature Control, accuracy within 2
6. Upper temperature zone can be moved freely, Second zone can be adjusted up and down.
7. Three temperature zones to heat up independently.
8. Hot air nozzle can be rotated in 360 degree
9.Perfect support Soldering, Desoldering, Removing and Reballing the BGA Chip
10. Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
11. With CE certification, double over temperature protection function

The Parameter of bga rework station :
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Place of Origin |
Guang dong, China |
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Brand Name |
LY |
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Moed Number |
LY-G720 bga rework station |
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Superior function |
Can create relevant temp,curves according to chips size |
Detail Specification
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Power |
AC 220V±10% 50/60Hz |
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Total Power
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5100W |
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Heater power
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upper temp.zone 1200w, second temp.zone 1200w, IR teom.zone 2700w |
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Temperature Controlling |
K-type thermocouple close-loop control,independent temp.controller, the precision can reach ±1 |
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PCB size
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Max:370*380mm Min:10*10mm |
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Applicable chips
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Max: 80*80mm Min 1x1mm |
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Thermocouple Ports |
1 units |
Nozzles x 5: 18mm,28mm,38mm,41mm,50mm






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